Wireless Chip Architect

About the Business Unit:

Ceva is at the forefront of the Smart Edge revolution, with innovative state-of-the-art Silicon and Software solutions that enable products to Connect, Sense and Infer. Our advanced wireless technologies, including Bluetooth, Wi-Fi, UWB, and Cellular IoT, are integrated into over a Billion devices annually. We are offering you a unique opportunity to shape and make a great impact on the roadmap of connected devices.

About the role:

In this role, you will be at the intersection of cutting-edge wireless technology and direct customer engagement. As a Wireless Architect, you drive the definition of connectivity subsystem architectures for next-generation products including Wi-Fi, Bluetooth, and UWB with mixed analog/digital hardware. You will also serve as a key technical partner for our customers, may take part in technical pre-sales, co-develop joint solution offerings, and bring a creative, flexible mindset to solving complex real-world connectivity challenges. This requires architectural depth from concept through productization.

Responsibilities:

Drive full-system view of how the connectivity subsystem interacts within an SoC, including CPU/processor, memory, and peripheral interfaces

Definition of connectivity subsystem architecture specifications including :

• Feature-set definition and PPA (Power, Performance, Area) targets
• Definition of system low power modes and PMU requirements
• Definition of HW and SW interfaces of the connectivity sub-systems including: HW interfaces, state machines, operation sequences etc…
• Analog and digital domains partitioning

Customer facing and technical engagement

• Lead technical discussions with customers, presenting connectivity architecture options and value propositions
• Co-develop joint solution offerings with customers and partners, acting as technical advisor during system integration phases

Support product lifecycle and productization

• Support post-tape-out testing, production validation, and productization of wireless connectivity solutions
• Lead or contribute to production-readiness activities including silicon characterization, yield analysis, and qualification testing

Cross-functional leadership

• Work closely with logic design, physical design, firmware, and validation teams to ensure successful implementation
• Support wireless subsystem integration process from architectural definition through implementation, lab integration and test coverage planning
• Collaborate with product management and business development stakeholders to translate customer feedback into architectural requirements and product roadmap inputs

Requirements:

• B.Sc. or M.Sc in Electrical Engineering
• Deep understanding of full-system SoC architecture, with emphasis on how connectivity subsystems interact with processors, memory controllers, power domains, and software stacks
• Product engineering experience: deep understanding of full lifecycle including post tape-out testing, silicon bring-up, productization, and production qualification.
• Experience in system definition for wireless communication systems
• Experience in wireless communication standards (such as WiFi/BT/Cellular/UWB)
• Experience in ASIC design and architecture, with proven experience in successful tape-outs and production
• Knowledge in performance and power modeling and analysis
• Deep understanding of VLSI development process and methods
• Technical leadership
• Strong communicator, able to translate complex architectural concepts for customers, executives, and engineering teams.
• Creative and flexible mindset: comfortable navigating ambiguous requirements and proposing pragmatic, innovative solutions
• Proven customer facing experience. Leading technical discussion, building trust, and influencing design decisions.

Advantages:

• Knowledge in RF integration and performance optimization
• Previous experience with 3rd party IP integration
• Knowledge in CPU/Processor architecture