Senior Program Manager, Chip Assembly Manufacturing Operations

NVIDIA is changing the world with its relentless focus on the accelerated computing that has launched the AI revolution. We continue to deliver accelerated computing solutions to ever growing field of applications such Robotics, Autonomous Driving, Genetics, Finance and Professional Visualization. NVIDIA has been transforming computer graphics, PC gaming, and accelerated computing for more than 30 years. We provide an incredible mix of uniquely talented people who provide technology solutions that have a lasting impact. As an NVIDIAN, you’ll be immersed in a diverse, supportive environment where everyone is inspired to do their best work every day. Come join the team and experience the company which is driving AI revolution. NVIDIA Operations team is turbocharging the relentless product volume and revenue growth through speed of light execution and creative supply chain and technology solutions.

NVIDIA’s Operations team is looking for a Senior Engineering Manager, Chip Assembly Manufacturing Operations. We need someone who has a solid technical background as well as an excellent reputation with our manufacturing partners. You will be reporting to Director of IC Supply Chain and Manufacturing in the Operations group.

What You Will Be Doing:

• Bring new products and new technologies to high volume manufacturing

• Deliver datamation solutions for enhanced decision making

• Manage supplier performance evaluation matrix and keep it updated based on changing business needs

• Drive continuous improvement in manufacturing yield, cycle time and product quality/reliability

• Lead change control through qualification and notification

• Lead non-conforming material disposition

• Manage BOM supply chain and optimize sourcing solutions for best capacity and cost

What We Need To See:

• Master’s degree or higher in Engineering or Science with emphasis on Mechanical, Materials Science, Chemical Engineering fields (or equivalent experience)

• 12+ years of validated experience in Flip Chip semiconductor packaging design, process and materials development. Direct experience in advanced assembly technologies such as 2.5D/3D packaging, Photonics packaging experience is desirable

• Solid technical knowledge of materials, process, package design and equipment technologies in substrate, bumping, and chip assembly

• Strong skills in project management and supplier management

• Solid understanding of quality control, statistics process control, gage R&R and DOE techniques

• Good knowledge of packaging industry and its supply chain

• Excellent written and verbal communication skills

• Experience working with multi-functional teams across the world

Widely considered to be one of the technology world’s most desirable employers, NVIDIA offers highly competitive salaries and a comprehensive benefits package. With highly competitive salaries and a comprehensive benefits package, NVIDIA is widely considered to be one of the technology world’s most desirable employers. We have some of the most forward-thinking and hardworking people on the planet working for us. If you're creative and autonomous, with a genuine passion for technology, we want to hear from you.

Your base salary will be determined based on your location, experience, and the pay of employees in similar positions. The base salary range is 184,000 USD - 287,500 USD.Applications for this job will be accepted at least until November 18, 2025.NVIDIA is committed to fostering a diverse work environment and proud to be an equal opportunity employer. As we highly value diversity in our current and future employees, we do not discriminate (including in our hiring and promotion practices) on the basis of race, religion, color, national origin, gender, gender expression, sexual orientation, age, marital status, veteran status, disability status or any other characteristic protected by law.