Product Development Engineer

Our vision is to transform how the world uses information to enrich life for all .
Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever.
Develop, configure and optimize Package Assembly processes (front end, bonding and back end) for company's memory products from pathfinding through New Product Introduction (NPI) start up including side by side certification with Manufacturing teams. Assess processes by knowledge and skills, taking measurements and interpreting data are everyday responsibilities and expectations for the successful candidate. Work closely with design teams (Globally) in the design approvals (substrate and silicon), running, testing and upgrading systems and processes, approving the materials, process and equipment changes in the CCB (change control board). Deep fundamental understanding of the key risks in Bumping, Flip chip and HBM technologies. Experience with TCB (Thermal Compression Bonding), CMP (Chemical Mechanical Polish), and Ball Mount. Hands on integration experience in Package Assembly and Wafer Level package process. Conduct supplier interactions/meetings and drive NDAs for new projects, which all together requires a significant understanding of the processes, first principles and process control systems. Improve benchmark performance and efficiency gains through global project management and execution. Network BKM leveraging and enhancement, business process creation and re-engineering. Maintain a strong and open relationship with peer group and managers in other functional areas within central team and outside in areas such as Sites, TD, Product Engineering, GQ. Communicate. Business process governance between Fab and Assembly. Lead Process Integration (PI) programs, PI Loop taskforce or team in network to address yield and quality challenges, optimize process flow. Identify, Propose & Drive new initiatives and programs. Propose & lead strategic programs to shorten cycle learning. Process flow simplifications & standardizations. Cross technology streamline (Process, tools, etc.). Drive roadmaps with cross functional teams.
Employer will accept a Bachelor's degree in Electrical Engineering, Mechanical Engineering, Materials Science, Chemical Engineering, Chemistry, Physics or related field and 4 years of experience in the job offered or in a Product Development Engineer-related occupation.
Position requires experience in:
1. Semiconductor packaging technology development, process integration, and new product introduction (NPI);
2. Frontend fabrication processes (FAB);
3. Development and implementation of cutting-edge semiconductor Assembly/ Packaging technologies;
4. Leading cross-functional teams in process development, technology transfer, and ramp-up;
5. Data analysis, statistical process control (SPC), and process optimization;
6. JMP, Power BI, Confluence, and JIRA for statistical analysis, data visualization, project management, and issue tracking.
As a world leader in the semiconductor industry, Micron is dedicated to your personal wellbeing and professional growth. Micron benefits are designed to help you stay well, provide peace of mind and help you prepare for the future. We offer a choice of medical, dental and vision plans in all locations enabling team members to select the plans that best meet their family healthcare needs and budget. Micron also provides benefit programs that help protect your income if you are unable to work due to illness or injury, and paid family leave. Additionally, Micron benefits include a robust paid time-off program and paid holidays. For additional information regarding the Benefit programs available, please see the Benefits Guide posted on micron.com/careers/benefits .
Micron is proud to be an equal opportunity workplace and is an affirmative action employer. All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, age, national origin, citizenship status, disability, protected veteran status, gender identity or any other factor protected by applicable federal, state, or local laws.
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