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Hewlett Packard Enterprise

Printed Circuit Board (PCB) Layout Engineer

Posted 2 Hours Ago
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In-Office
Spring, TX
96K-221K Annually
Expert/Leader
In-Office
Spring, TX
96K-221K Annually
Expert/Leader
Design and release complex multilayer, high-speed PCB layouts for high-performance computing systems. Responsibilities include interpreting schematics, determining component placement and routing approaches, addressing signal- and power-integrity issues, meeting mechanical, thermal, EMC, DFM, and manufacturing requirements, and coordinating with cross-functional engineering teams and manufacturing partners.
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Printed Circuit Board (PCB) Layout Engineer

  

This role has been designed as ‘’Onsite’ with an expectation that you will primarily work from an HPE office.

Who We Are:

Hewlett Packard Enterprise is the global edge-to-cloud company advancing the way people live and work. We help companies connect, protect, analyze, and act on their data and applications wherever they live, from edge to cloud, so they can turn insights into outcomes at the speed required to thrive in today’s complex world. Our culture thrives on finding new and better ways to accelerate what’s next. We know varied backgrounds are valued and succeed here. We have the flexibility to manage our work and personal needs. We make bold moves, together, and are a force for good. If you are looking to stretch and grow your career our culture will embrace you. Open up opportunities with HPE.

Job Description:

   

We are seeking an experienced Printed Circuit Board (PCB) Layout Engineer to design complex printed circuit boards (PCBs) for high-performance computing systems. The PCB Design Engineer will work independently to lay out and help release cutting-edge, high-speed PCBs into production.


Responsibilities:

  • Design printed circuit board layouts using computer-aided design software, consistent with electrical engineering circuit-performance, signal-integrity, and EMI specifications; mechanical engineering form factor and thermal requirements; and manufacturing requirements.
  • Read and interpret schematics, system functionality and performance specifications, and company PCB design guidelines as necessary to complete printed circuit board layouts.
  • Determine PCB design approaches and parameters.
  • Influence design decisions related to the analysis and resolution of system-performance issues associated with printed circuit board layout.

Education and Experience:

  • Associate degree or equivalent technical degree with 10+ years of experience laying out complex, multilayer, high-speed printed circuit boards.
  • Bachelor’s degree in Electrical Engineering or equivalent technical degree with 4+ years of experience laying out complex, multilayer, high-speed printed circuit boards.
  • Advanced knowledge of ECAD software, particularly Cadence Allegro PCB Editor required.
  • Advanced knowledge of PCB design guidelines and design constraints.
  • Experience performing layout studies, determining component placement, and helping drive sound architectural decisions.
  • Experience laying out boards with DDR4 or newer, PCIe Gen 4 or newer, high-speed SerDes, Ethernet, I²C, SPI, and similar interfaces.
  • Experience with high-speed routing techniques, such as microvias, blind and buried vias, and backdrilling.
  • Experience working with PCB fabrication shops and PCA contract manufacturers.
  • Experience with liquid-cooled designs is a plus.
  • Experience helping define ASIC package ball maps is a plus.
  • Experience with industry-standard form factors, such as PCIe CEM and Open Compute Project, is a plus.
  • Experience creating symbols and managing symbol libraries is a plus.

Knowledge and Skills:

  • Ability to read and interpret schematics, datasheets, and layout guidelines.
  • Ability to work with—and, when necessary, lead—engagements with design partners, including electrical engineers, mechanical engineers, signal-integrity and power-integrity engineers, and others.
  • Working knowledge of electronics, including signal- and power-integrity issues.
  • Understanding of EMC principles and best practices for mitigating EMI.
  • In-depth knowledge of Design for Manufacturing (DFM) and Design for Test (DFT) principles.
  • Ability to work independently with loosely defined parameters and perform conceptual analysis.
  • Ability to work successfully with engineers across various geographies to meet design requirements and schedules.
  • Ability to manage multiple board designs simultaneously.
  • Excellent written and verbal communication skills.

Accessibility


HPE is committed to creating an inclusive and accessible workplace and encourages applications from all qualified individuals, including those with disabilities. If you believe you require accommodation during any stage of the application or interview process, please submit your request by completing our secure form linked here.


Note: This option is reserved for applicants needing assistance/reasonable accommodation related to a disability.

What We Can Offer You:

Health & Wellbeing

We strive to provide our team members and their loved ones with a comprehensive suite of benefits that supports their physical, financial and emotional wellbeing.

Personal & Professional Development

We also invest in your career because the better you are, the better we all are. We have specific programs catered to helping you reach any career goals you have — whether you want to become a knowledge expert in your field or apply your skills to another division.

Unconditional Inclusion

We are unconditionally inclusive in the way we work and celebrate individual uniqueness. We know varied backgrounds are valued and succeed here. We have the flexibility to manage our work and personal needs. We make bold moves, together, and are a force for good.

Let's Stay Connected:

Follow @HPECareers on Instagram to see the latest on people, culture and tech at HPE.

#unitedstates#compute

Job:

Engineering

Job Level:

TCP_03

    

"The expected salary/wage range for this position is provided below. Actual offer may vary from this range based upon geographic location, work experience, education/training, and/or skill level.
– United States of America: Annual Salary USD 95,800 - 220,500 in Texas & Wisconsin
The listed salary range reflects base salary. Variable incentives may also be offered."

Information about employee benefits offered in the US can be found at https://myhperewards.com/main/new-hire-enrollment.html

HPE is an Equal Employment Opportunity/ Veterans/Disabled/LGBT employer. We do not discriminate on the basis of race, gender, or any other protected category, and all decisions we make are made on the basis of qualifications, merit, and business need. Our goal is to be one global team that is representative of our customers, in an inclusive environment where we can continue to innovate and grow together. Please click here: Equal Employment Opportunity.

Hewlett Packard Enterprise is EEO Protected Veteran/ Individual with Disabilities.

   

HPE will comply with all applicable laws related to employer use of arrest and conviction records, including laws requiring employers to consider for employment qualified applicants with criminal histories.

   

Recruitment Fraud Alert

We have become aware of an increase in fraudulent recruitment activities in which individuals impersonate our company or authorized recruitment agencies to offer fake employment opportunities. These scams may occur through false websites, emails, social media, or chat-based applications and often aim to obtain personal information or money. Please note that Hewlett Packard Enterprise (HPE), its direct and indirect subsidiaries and affiliated companies, and its authorized recruitment agencies/vendors will never charge a candidate a registration fee, hiring fee, or any other fee in connection with its recruitment and hiring process. We also never request personal information such as back account details, Social Security numbers, or national IDs via social media or chat applications.

All legitimate job opportunities will come through official company channels, and candidates are responsible for verifying the credentials of any third party claiming to represent the company. Any reliance on fraudulent communication is at the individual’s own risk, and HPE disclaims legal liability for any resulting damages. If you suspect recruitment fraud, do not share personal information or make any payments and report the incident to your local authorities immediately.

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