Northrop Grumman
Printed Circuit Board (PCB) Layout Designer Engineer/Principal Printed Circuit Board (PCB) Layout Designer Engineer
The Product Engineering Department, as part of Western Region Electronics & Payload Engineering is seeking a Printed Circuit Board (PCB) Layout Designer Engineer/Principal Printed Circuit Board (PCB) Layout Designer Engineer, to join the team. The position will be located in Manhattan Beach, CA. This position can support a Hybrid work schedule, with the ability to come on site as needed.
The Product Engineering Department is an organization of roughly 70 engineers that performs advanced electronic packaging development in support of a variety of products destined for space and air programs.
In this role you will:
Work with all engineering disciplines to incorporate their constraints into the Mentor Xpedition PCB CAD database
Understand and adhere to the core Product Engineering PCB design processes, ensuring that the team understands and remain compliant
Develop an expert understanding of our high reliability design standards
Lead PCB design reviews, and help to create PCB design schedules
Become knowledgeable with our internal build specs, industry standards, and understand PCB manufacturability.
This requisition may be filled at either a Printed Circuit Board (PCB) Layout Designer Engineer or Principal Printed Circuit Board (PCB) Layout Designer Engineer level based on the qualifications listed below.
Basic Qualifications (T02 – Engineer, Electromechanical):
A Bachelor of Science degree in a STEM (Science, Technology, Engineering or Math) discipline and 2 years of engineering experience in an aerospace environment, or a Master’s Degree in Mechanical or Electrical Engineering and 0 years of engineering experience in an aerospace environment
The ability to obtain and maintain a DoD TS/SCI clearance
Familiar with engineering/layout of printed circuit boards
Familiar with engineering of printed circuit boards as well as experience in PCB layout using Xpedition or another CAD tool
Good organizational and problem- solving skills
Knowledge of how PCBs are produced and current understanding of design and manufacturability challenges
Preferred Qualifications:
Experience with layout using Siemens (Mentor Graphics) Xpedition
Master’s Degree in Mechanical or Electrical Engineering
Experience with electronic packaging / mechanical design for airborne and space applications
Experience with electronics design development and sustaining spanning cradle to grave
An active DoD Secret or Top Secret, and/or SCI clearance
Basic Qualifications (T03 – Principal Engineer, Electromechanical):
A Bachelor of Science degree in a STEM (Science, Technology, Engineering or Math) discipline with 5 years of engineering experience in an aerospace environment; OR Master’s Degree in in a STEM (Science, Technology, Engineering or Math) discipline with 3 years of engineering experience in an aerospace environment
The ability to obtain and maintain a TS/SCI clearance
Minimum 3 years of Experience with engineering/layout of printed circuit boards using Mentor Xpedition
Experience with engineering/layout of printed circuit boards
Experience collaborating with diverse stakeholders across organizations and programs
Excellent organizational and problem- solving skills with a demonstrated ability to adapt effectively to changing requirements
Current understanding of IPC industry standards
Familiarity with electronic parts and their specs, especially high reliability Mil Standard parts
Working knowledge of how PCBs are produced and current understanding of design and manufacturability challenges
Preferred Qualifications:
Master’s Degree in Mechanical or Electrical Engineering
Experience with electronic packaging / mechanical design for airborne and space applications
Experience with electronics design development and sustaining spanning cradle to grave
An active DoD Secret or Top Secret, and/or SCI clearance
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