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Blue Origin

Principal FPGA Engineer - TeraWave

Reposted 2 Days Ago
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In-Office or Remote
9 Locations
231K-323K Annually
Senior level
In-Office or Remote
9 Locations
231K-323K Annually
Senior level
Lead architecture and implementation of space-optimized silicon and packaging solutions (ASIC/FPGA) including 2.5D/3D packaging, chiplets, thermal/mechanical co-design, radiation mitigation, verification, and coordination with foundry/packaging partners to ensure manufacturability and space qualification.
The summary above was generated by AI

Application close date:

Applications will be accepted on an ongoing basis until the requisition is closed.

At Blue Origin, we envision millions of people living and working in space for the benefit of Earth. We’re working to develop reusable, safe, and low-cost space vehicles and systems within a culture of safety, collaboration, and inclusion. Join our team of problem solvers as we add new chapters to the history of spaceflight!  

This role is part of TeraWave, a satellite communications network designed to deliver symmetrical data speeds of up to 6 Tbps anywhere on Earth. This network will service tens of thousands of enterprise, data center, and government users who require reliable connectivity for critical operations.

We are seeking a Senior Silicon Design Engineer specializing in Packaging and Co-Design for our revolutionary TeraWave satellite communications network. This role will be instrumental in developing advanced silicon solutions that enable our constellation to deliver symmetrical data speeds of up to 6 Tbps globally. The ideal candidate brings expertise in advanced packaging technologies, system-in-package design, and silicon co-design methodologies, thriving in a fast-paced environment where innovation meets mission-critical execution.

Responsibilities include but are not limited to:

  • Define and architect custom silicon solutions including DSPs, SDR components, beamforming processors, and network processing units optimized for advanced packaging technologies
  • Lead technical architecture decisions and requirements definition for space-optimized processing solutions with focus on heterogeneous integration
  • Drive 2.5D and 3D packaging strategies including silicon interposers, chiplets, and advanced substrate technologies
  • Lead end-to-end ASIC/FPGA development from requirements through RTL design, verification, synthesis, physical design, and post-silicon validation
  • Develop co-design methodologies integrating electrical, thermal, and mechanical considerations for complex multi-die packages
  • Manage design flows and coordinate with foundry and packaging partners to ensure manufacturability
  • Implement and verify radiation tolerance techniques including SEU mitigation, TMR, ECC, and RHBD methodologies
  • Coordinate radiation testing and qualification campaigns to ensure space survivability
  • Drive design standards, verification strategies, IP library development, and documentation for advanced packaging
  • Establish design flows and best practices for space-grade silicon engineering across the program
  • Collaborate cross-functionally with systems engineers, RF engineers, avionics teams, thermal engineers, and software developers
  • Support requirements flow-down and interface definitions between chiplets and package components
  • Lead technical risk assessment and Failure Investigation Teams (FITs) for silicon design issues, radiation-induced failures, and flight anomalies
  • Develop mitigation strategies and corrective actions for packaging-related challenges
  • Provide recommendations for capital investments in EDA tools, verification platforms, emulation systems, and validation equipment

Minimum Qualifications:

  • B.S. degree in Electrical Engineering, Computer Engineering, or related field
  • 8+ years of experience in silicon design with focus on advanced packaging technologies
  • Demonstrated expertise in system-in-package design and heterogeneous integration
  • Experience with 2.5D/3D packaging technologies including interposers and chiplets
  • Knowledge of high-speed signaling in advanced packages
  • Experience with thermal and mechanical co-design for complex silicon solutions
  • Understanding of radiation effects on semiconductor devices and packaging materials
  • Proficiency with industry-standard EDA tools for package design and simulation

Preferred Qualifications:

  • M.S. or Ph.D. in Electrical Engineering with focus on semiconductor packaging
  • Experience with space-grade packaging technologies and qualification processes
  • Knowledge of RF/microwave packaging techniques for high-frequency applications
  • Experience with power delivery network design for complex multi-die packages
  • Background in designing for harsh environments including thermal cycling and radiation
  • Experience with silicon photonics integration and optical I/O technologies
  • Understanding of advanced cooling solutions for high-performance computing in space
  • Familiarity with reliability physics and failure mechanisms in advanced packages

 

Compensation Range for:

CA applicants is $230,773.00 - $323,081.85 WA applicants is $230,773.00 - $323,081.85

Other site ranges may differ

Culture Statement

Don’t meet all desired requirements? Studies have shown that some people are less likely to apply to jobs unless they meet every single desired qualification. At Blue Origin, we are dedicated to building an authentic workplace, so if you’re excited about this role but your past experience doesn’t align perfectly with every desired qualification in the job description, we encourage you to apply anyway. You may be just the right candidate for this or other roles.

Export Control Regulations

Applicants for employment at Blue Origin must be a U.S. citizen or national, U.S. permanent resident (i.e. current Green Card holder), or lawfully admitted into the U.S. as a refugee or granted asylum.

Background Check

  • Required for all positions: Blue’s Standard Background Check

  • Required for Certain Job Profiles:  Defense Biometric Identification System (DBIDS) background check if at any time the role requires one to be on a military installation

  • Required for Certain Job Profiles: Drivers who operate Commercial Motor Vehicles with a Gross Vehicle Weight (GVW), Gross Vehicle Weight Rating (GVWR) or combination of power unit and trailer that meets or exceeds 10,001 lbs. and/or transports placardable amounts of hazardous materials by ground in any vehicle on a public road while in commerce, may be subject to additional Federal Motor Carrier Safety Regulations including: Driver Qualification Files, Medical Certification (obtained before onboarding), Road Test, Hours of Service, Drug and Alcohol Testing (CDL drivers only), vehicle inspection requirements, CDL requirements (if applicable) and hazardous materials transportation/shipping training.

  • Required for certain Job Profiles: Ability to obtain and maintain Merchant Mariner Credential, which includes pre-employment and random drug testing as well as DOT physical

Benefits

  • Benefits include:  Medical, dental, vision, basic and supplemental life insurance, paid parental leave, short and long-term disability, 401(k) with a company match of up to 5%, and an Education Support Program.

  • Paid Time Off:  Up to four (4) weeks per year based on weekly scheduled hours, and up to 14 company-paid holidays.

  • Dependent on role type and job level, employees may be eligible for benefits and bonuses based on the company's intent to reward individual contributions and enable them to share in the company's results, or other factors at the company's sole discretion. Bonus amounts and eligibility are not guaranteed and subject to change and cancellation. Please check with your recruiter for more details.

Equal Employment Opportunity

Blue Origin is proud to be an Equal Opportunity/Affirmative Action Employer and is committed to attracting, retaining, and developing a highly qualified and dedicated work force. Blue Origin hires and promotes people on the basis of their qualifications, performance, and abilities. We support the establishment and maintenance of a workplace that fosters trust, equality, and teamwork. We provide all qualified applicants for employment and employees with equal opportunities for hire, promotion, and other terms and conditions of employment, regardless of their race, color, religion, sex, sexual orientation, gender identity, national origin/ethnicity, age, physical or mental disability, genetic factors, military/veteran status, or any other status or characteristic protected by federal, state, and/or local law. Blue Origin will consider for employment qualified applicants with criminal histories in a manner consistent with applicable federal, state, and local laws, including the Washington Fair Chance Act, the California Fair Chance Act, the Los Angeles Fair Chance in Hiring Ordinance, and other applicable laws. For more information on “Know Your Rights,” please see here.

Affirmative Action and Disability Accommodation

Applicants wishing to receive information on Blue Origin’s Affirmative Action Plans, or applicants requiring a reasonable accommodation in order to participate in the application and/or interview process, please contact us at [email protected]. Please note this is a publicly managed inbox. Please do not include any personal medical information in your request.

California Applicant Privacy Notice

If you are a California resident, please reference the CA Applicant Privacy Notice here.

Top Skills

Fpga,Asic,Rtl,2.5D Packaging,3D Packaging,Silicon Interposers,Chiplets,System-In-Package,Heterogeneous Integration,High-Speed Signaling,Thermal Co-Design,Mechanical Co-Design,Seu Mitigation,Tmr,Ecc,Rhbd,Radiation Testing,Post-Silicon Validation,Eda Tools,Silicon Photonics,Optical I/O,Power Delivery Network (Pdn) Design,Rf/Microwave Packaging,Emulation Systems,Dsp,Sdr,Beamforming Processors,Network Processing Units

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