VP of Product Engineering - Silicon Photonics

About Neurophos:

We are developing an ultra-high-performance, energy-efficient photonic AI inference system. We’re transforming AI computation with the first-ever metamaterial-based optical processing unit (OPU).

As AI adoption accelerates, data centers face significant power and scalability challenges. Traditional solutions are struggling to keep up, leading to rapidly rising energy consumption and costs. We’re solving both problems with an OPU that integrates over one million micron-scale optical processing components on a single chip. This architecture will deliver up to 100 times the energy efficiency of existing solutions while significantly improving large-scale AI inference performance.

We’ve assembled a world-class team of industry veterans and recently raised a $110M Series A led by Gates Frontier. Participants include M12 (Microsoft’s Venture Fund), Carbon Direct Capital, Aramco Ventures, Bosch Ventures, Tectonic Ventures, Space Capital, and others. We have also been recognized on the EE Times Silicon 100 list for several consecutive years.

Join us and shape the future of optical computing!

Location: Austin, TX or San Francisco, CA. Full-time onsite position.

Position Overview:

We are seeking a visionary VP Product Engineering to report to the CTO and lead the establishment and scaling of our product engineering organization from the ground up, enabling the next generation of AI. This is a hands-on technical leadership role where you will not only build and mentor a high-performing team but also personally dive deep into solving some of the industry’s greatest technological challenges—rolling up your sleeves to design, prototype, troubleshoot, and iterate on our game-changing photonic AI modules. With demonstrated deep technical expertise, you will drive critical functions, including forging and managing relationships with world-class foundries, OSATs, and module assembly partners; architecting and leading IC, photonics, and optical assembly processes with a focus on co-packaged optics; executing module characterization, thermal, and mechanical design; and owning reliability and failure analysis activities. A core must-have is proven experience taking products from initial definition to high-volume production, incorporating DFM and DFT principles to ensure scalable, robust outcomes. In this executive-level position, you will ensure seamless transitions from R&D prototypes to high-volume production, mitigating risks, optimizing yields, and aligning with hyperscaler customer requirements in a fast-paced, fast-growing startup environment. Your technical leadership will be pivotal in addressing complex challenges in silicon photonics and optical computing, blending strategic oversight with direct engineering contributions.

Key Responsibilities:

• Build and lead a world-class product engineering team from the ground up, including recruiting top talent in IC and photonics assembly, characterization, thermal/mechanical design, and reliability engineering; while personally contributing hands-on technical guidance to foster a collaborative, innovative culture aligned with Neurophos' mission to accelerate AI hardware.

• Establish and manage strategic partnerships with foundries, OSATs, and module assembly partners, negotiating contracts, overseeing qualifications, and ensuring supply chain resilience for high-volume photonic module production.

• Define, architect, and oversee IC assembly and integration, with a focus on co-packaged optics (CPO) architectures, including vertical integration, signal integrity, thermal design, and hybrid integration of metasurfaces, photonic integrated circuits, and photodetectors to achieve optimal performance and yield.

• Lead thermal design efforts for photonic modules, utilizing simulation tools (e.g., ANSYS, COMSOL) to model heat dissipation in high-power AI compute environments, identifying materials and structures for efficient thermal conduction, optimizing cooling solutions for copackaged modules, and ensuring reliability under hyperscaler workloads.

• Design and deploy active-alignment tools and processes, as well as optical and electrical calibration equipment on-site and at our module assembly partners’ facilities.

• Drive module characterization programs, defining and executing test methodologies.

• Direct mechanical design and packaging strategies, including substrate selection, enclosure design, and vibration/thermal cycling resilience for free-space optics and integrated modules, while integrating DFX principles.

• Own end-to-end reliability and failure analysis, implementing PoF (physics-of-failure) models, stress testing (e.g., JEDEC-compliant thermal/humidity cycling, electromigration), and root-cause analyses using SEM, FIB, TEM, and CSAM; collaborate with customers on FIT rates, lifetime projections, and CAR, with direct involvement in lab-based analysis.

• Collaborate cross-functionally with R&D, silicon photonics, optics, and VLSI teams to align on product roadmaps, perform risk assessments (e.g., FMEA), and drive continuous improvements in yield, cost, and scalability for AI hardware.

• Develop innovative solutions to our groundbreaking products, and translate those innovations to patents to add to our growing portfolio.

• Stay abreast of industry advancements in photonic integration, co-packaged optics, and AI hardware manufacturing through ecosystem engagement, publications, and standards bodies (e.g., IEEE, OIF), informing Neurophos' innovation pipeline with hands-on application to our technology.

Qualifications:

• Experience delivering optical or photonics assemblies, including developing and transferring to production active alignment setups.

• Hands-on expertise across IC assembly (including co-packaged optics), module characterization, thermal/mechanical design, reliability engineering, and failure analysis, with personal involvement in transitioning products from prototype to high-volume manufacturing.

• Advanced degree (Master's or Ph.D.) in Electrical Engineering, Mechanical Engineering, Materials Science, Applied Physics, or a related field, with a strong foundation in semiconductor physics, photonics, and integrated optics.

• 15+ years of progressive, hands-on experience in product engineering within semiconductor, silicon photonics, or optical computing companies, including 5+ years in senior technical leadership roles where you personally contributed to building and scaling engineering teams.

• Demonstrated deep technical expertise and direct experience taking products from initial definition through to high-volume production, including rigorous application of DFM and DFT principles to optimize manufacturability, testability, yield, and cost—proven across multiple product cycles in photonic or semiconductor hardware.

• Proven track record managing relationships with first-tier suppliers (foundries, OSATs, photonic module assembly partners), including contract negotiation, yield optimization, and supply chain risk mitigation in fast-paced environments—through direct technical engagements.

• Exceptional leadership and people management skills, combined with a hands-on technical mindset, with a history of recruiting diverse, high-caliber teams and driving cross-functional execution in resource-constrained startup settings through your own deep involvement.

• Outstanding communication and stakeholder management abilities, capable of translating complex technical concepts for executives, customers, and partners while thriving in ambiguity and rapid iteration.

• Analytical mindset with expertise in data-driven decision-making, including yield modeling, failure mode analysis, and process optimization for photonic and electronic components.

Preferred Qualifications:

• Experience with AI/hardware ecosystems, including delivering on hyperscaler requirements for optical interconnects, power efficiency, and scalability in data center applications.

• Hands-on leadership experience at photonic or optical large corporations or executive experience in photonics startups, with direct involvement in CPO deployments or AI accelerator hardware (e.g., GPU/TPU integration).

• Strong proficiency in design and analysis tools (e.g., ANSYS for thermal modeling, JMP/Minitab for statistical analysis) and industry standards (e.g., JEDEC, IPC, ISO for quality/reliability).

• Background in operational excellence, including lean manufacturing principles for high-volume products.

• Publications, patents, or conference contributions in silicon photonics, co-packaged optics, or reliability for optical modules.

• Familiarity with emerging technologies like metamaterials, compute-in-memory, or 3D heterogeneous integration.

• Direct hands-on experience working with free-space optics, as well as productization of camera or optical modules from concept to production.

What We Offer:

• A pivotal role in an innovative startup redefining the future of AI hardware.

• A collaborative and intellectually stimulating work environment.

• Competitive compensation, including salary and equity options.

• Good benefits - health, vision, dental, 401 (k), etc.

• Opportunities for career growth and future team leadership.

• Access to cutting-edge technology and state-of-the-art facilities.

• Opportunity to publish research and contribute to the field of efficient AI inference.

This is a rare opportunity to work on a game-changing technology at the intersection of photonics and AI. As part of our elite team, you’ll contribute to a platform that redefines computational performance and accelerates the future of artificial intelligence. Be a key player in bringing this transformative innovation to the world.