Develops and sustains wafer-level bonding, alignment, etching, electroplating, CMP, grinding, and dicing processes for MEMS fabrication. Improves yield, reduces defects, optimizes process stability, performs DOE and root cause analysis, monitors SPC, and supports equipment qualification and uptime. Collaborates with process engineering, integration, R&D, production, and quality teams in a cleanroom manufacturing environment.
Summary:
Atomica is a U.S.-based microfabrication foundry that builds advanced platforms for AI hardware, photonics, sensors, MEMS, and biotechnology devices. Atomica supports customers developing AI optical connectivity, AI optical source integration, photonic integration, thermal microstructures, physical AI sensors, MEMS optical control systems, and biotechnology microdevices with rapid prototyping and scalable production.
We are seeking a highly skilled and motivated Substrate Process Engineer with expertise in wafer bonding and high-precision alignment to join our MEMS fabrication team. This role focuses on developing and sustaining critical wafer-level bonding and alignment processes, such as anodic, fusion, direct, and adhesive bonding, with a strong emphasis on sub-micron to micron-level alignment accuracy required for MEMS device integration. The candidate will work closely with process engineering, integration, and R&D teams to enable reliable and scalable backend processes in a cleanroom manufacturing environment.
Key Responsibilities:
- Develop and maintain wafer bonding processes (eutectic, thermocompression, direct, adhesive).
- Wet etch processes (Si, oxide, metals) including rate and uniformity control.
- Support electroplating processes (Au, Cu, Ni, NiFe, AuSn).
- Support Dicing, CMP , wafer Grinding processes.
- Improve yield, reduce defects, and optimize process stability.
- Perform DOE, root cause analysis, and SPC monitoring.
- Support equipment qualification and uptime.
- Work closely with R&D, production, and quality teams.
Qualifications:
- B.S. or M.S. in Engineering (Materials, Chemical, Electrical, Mechanical, or related)
- 3+ years experience in semiconductor or MEMS fabrication
- Hands-on experience in at least two of the following:
- Wafer bonding
- Wet etching
- Electroplating
- CMP or wafer thinning
- Dicing
Why work with us?
Atomica is changing the world. Working at Atomica is truly a one-of-a-kind opportunity to impact groundbreaking technology while living in paradise.
Your contributions to our MEMS technology will drive innovation, solve the great problems of our time and directly impact the lives of people across the globe.
Life in Santa Barbara:
Want to live in paradise? Life in Santa Barbara is just that. Atomica is sandwiched between the beautiful Santa Ynez mountains and the pristine Central California coastline. The weather? Absolutely gorgeous. No more shoveling snow or hiding from tornadoes!
Within 5-minutes from the office, you will find rich local culture, world class schools, airport for convenient travel, festivals, and excellent options to wine and dine.
We have had employees move from all over the country and say life has never been better!
Compensation:
$90,000-$140,000
*Atomica encourages applications from candidates at all levels where pay will be based on experience.*
Atomica Santa Barbara, California, USA Office
75 Robin Hill Road, Santa Barbara, CA , United States, 93117
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