Senior Wire Bonder

Description

 The Senior Wire Bonder performs advanced precision wire bonding and micro-electronic assembly. This role works independently to complete complex bonding tasks and ensure workmanship meets strict engineering and quality standards. In addition to hands-on production responsibilities, the Senior Wire Bonder helps mentor less-experienced team members and contributes to process improvements and documentation development. The ideal candidate is highly detail-oriented, technically skilled, and comfortable working with delicate components under magnification. 

• Perform precision wedge and ball wire bonding on MIC and MMIC circuits in accordance with engineering drawings and bonding diagrams
• Read, interpret, and follow detailed circuit layout drawings, work instructions, and technical documentation
• Conduct pre-cap inspection and MIC assembly inspection to verify bond integrity and workmanship quality
• Execute manual gap welding operations and other precision joining techniques as required
• Set up, adjust, and qualify wire and ribbon bonding equipment, including performing minor troubleshooting and daily verification checks
• Support production of military, aerospace, and space-flight hardware, ensuring compliance with strict quality and documentation standards
• Assist in the development and improvement of wire bonding work instructions and process documentation
• Train and mentor new or less-experienced wire bonders, sharing technical knowledge and best practices
• Capture and maintain photographic documentation of assemblies for quality records and engineering review
• Operate specialized equipment including plasma cleaning systems, bake ovens, hot work holders, and thermal compression machines
• Accurately document manufacturing steps, inspections, and process verifications on production travelers
• Provide technical support to AMP assembly or other production teams as needed
• Maintain a clean, organized, and ESD-controlled work environment
• Team player with a positive attitude, eager to collaborate and contribute to the success of the team.
• Support special projects, providing additional assistance and resources as needed.
• Exemplify QuinStar’s Core Values: Accountability, Compassion, and Tenacity in all tasks, ensuring that your work directly contributes to team success and company growth.
   

Requirements

•  Due to federal contract requirements, U.S. citizens are eligible for this role. 
•  High school diploma or equivalent experience
• 8–10 years of experience in precision wire bonding, micro-electronics assembly, semiconductor, or aerospace manufacturing
• Proven experience performing wedge and/or ball wire bonding on small electronic components
•  Ability to read and interpret bonding diagrams, circuit layout drawings, and detailed work instructions
•  Strong understanding of micro-electronic assembly workmanship standards and inspection practices
•  Experience working with delicate components under a microscope for extended periods
•  Ability to set up, adjust, and verify bonding equipment to meet process requirements
•  Strong attention to detail and ability to work independently with minimal supervision
•  Effective communication skills.
•  Basic computer skills for documentation and recordkeeping

Physical Requirements:

Engage in the following activities for prolonged periods of time:

This role routinely uses standard office equipment such as computers, phones, photocopiers, and filing cabinets.

• Ability to remain seated or in a stationary position for extended periods 
• Strong manual dexterity and fine motor skills
• Ability to work under a microscope for prolonged periods
• Ability to move throughout lab, cleanroom, and light manufacturing environments

 *We offer a comprehensive benefits package that includes medical, dental, and vision insurance, 401(k) retirement plan, paid time off and holidays, and ongoing training and development opportunities to support your career growth.