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Micron Technology

Process Integration Engineer | APTD

Posted 3 Hours Ago
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In-Office
Boise, ID
Mid level
In-Office
Boise, ID
Mid level
The Process Integration Engineer develops and deploys interconnect technologies, coordinates with teams for product development, and ensures smooth production transitions. Requires expertise in semiconductor processes and advanced packaging.
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Our vision is to transform how the world uses information to enrich life for all .
Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever.
Department Intro:
The Technology Development (TD) department at Micron Technology is at the forefront of innovation, driving the advancement of memory and storage solutions that transform how the world uses information. This team is dedicated to developing innovative processes and technologies that enable the creation of next-generation semiconductor products. By collaborating closely with our global R&D and manufacturing teams, we ensure the efficient transfer and implementation of new technology nodes, maintaining Micron's leadership in the industry. Join this forward-thinking team that is molding the future of technology!
Position Overview:
As a Process Integration Engineer within APTD your responsibilities include but are not limited to developing and enabling deployment of advanced interconnect technologies. Successful development and deployment will ensure that products which use the developed technologies meet performance, cost, manufacturability, quality, reliability and schedule requirements. Also, you will have responsibility to work with peers and internal partners across organizations to coordinate the development and launch of new technologies and integration flows.
Responsibilities:
  • This role is open to candidates at Process Engineer Levels 2, 3, or 4 .
  • Work with peers, internal teams and external suppliers to develop new technology / capabilities required for innovative packaging solutions.
  • Provide innovative and efficient advanced packaging solutions on time and with best predictable reliability performance.
  • Work with peers to establish project timelines and verification of work needed to validate new technology.
  • Ensure smooth transition from new product development, qualification, small volume production to high volume production
  • Understand future trends, technology and capabilities required for future advanced packaging solutions
  • Work with peers and internal teams to define future roadmaps
  • Continually grow your own technical and management skills and pursue continued education.
  • Encourage and enforce safe, compliant behavior through periodic communications and the performance management process.
  • Maintain area procedures and training required to ensure legal compliance and conformance to management system
  • Support Internal and External Audits

Required Experience:
  • 3+ years of professional experience in the semiconductor industry.
  • MS or PhD in Electrical Engineering, Materials Science, Mechanical Engineering, Physics, Chemistry, or a closely related field, or equivalent professional experience demonstrating senior-level technical capability.
  • Professional experience in process integration, process development, advanced packaging, or closely related semiconductor technology domains within an R&D environment (IDM, foundry, OSAT, or equivalent).

Additional Qualifications (Preferred)
We recognize that highly qualified candidates may not meet every qualification listed below. Candidates whose experience aligns with most of these qualifications and who bring strong process integration and technical development leadership are encouraged to apply.
  • End-to-end ownership of integration solutions, including technology definition, process development, qualification, and successful transfer to high-volume manufacturing.
  • Deep, practical expertise in advanced packaging and interconnect technologies, such as:
  • 2.5D and 3DIC integration
  • Wafer-level and fan-out packaging
  • Wirebond , microbump , and/or hybrid bonding
  • Semiconductor technology background, with experience in memory (DRAM, NAND) and/or logic
  • Demonstrated strength in process integration problem-solving, including:
  • Design of Experiments (DoE) and data-driven decision making
  • Root-cause analysis and decision-making methodologies (e.g., KT or equivalent).

As a world leader in the semiconductor industry, Micron is dedicated to your personal wellbeing and professional growth. Micron benefits are designed to help you stay well, provide peace of mind and help you prepare for the future. We offer a choice of medical, dental and vision plans in all locations enabling team members to select the plans that best meet their family healthcare needs and budget. Micron also provides benefit programs that help protect your income if you are unable to work due to illness or injury, and paid family leave. Additionally, Micron benefits include a robust paid time-off program and paid holidays. For additional information regarding the Benefit programs available, please see the Benefits Guide posted on micron.com/careers/benefits .
Micron is proud to be an equal opportunity workplace and is an affirmative action employer. All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, age, national origin, citizenship status, disability, protected veteran status, gender identity or any other factor protected by applicable federal, state, or local laws.
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To learn more about Micron, please visit micron.com/careers
For US Sites Only: To request assistance with the application process and/or for reasonable accommodations, please contact Micron's People Organization at [email protected] or 1-800-336-8918 (select option #3)
Micron Prohibits the use of child labor and complies with all applicable laws, rules, regulations, and other international and industry labor standards.
Micron does not charge candidates any recruitment fees or unlawfully collect any other payment from candidates as consideration for their employment with Micron.
AI alert: Candidates are encouraged to use AI tools to enhance their resume and/or application materials. However, all information provided must be accurate and reflect the candidate's true skills and experiences. Misuse of AI to fabricate or misrepresent qualifications will result in immediate disqualification.
Fraud alert: Micron advises job seekers to be cautious of unsolicited job offers and to verify the authenticity of any communication claiming to be from Micron by checking the official Micron careers website in the About Micron Technology, Inc.

Top Skills

2.5D And 3Dic Integration
Advanced Packaging
Chemistry
Electrical Engineering
Fan-Out Packaging
Hybrid Bonding
Materials Science
Mechanical Engineering
Microbump
Physics
Semiconductor Technology
Wafer-Level Packaging
Wirebond

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