Micron Technology Logo

Micron Technology

Process Integration Engineer, APTD

Reposted 29 Minutes Ago
Be an Early Applicant
In-Office
Boise, ID
Mid level
In-Office
Boise, ID
Mid level
Develop and integrate advanced semiconductor process flows for next-generation memory products. Lead integration projects, design and analyze experiments, identify yield limiters and root causes, implement corrective actions, and support technology qualification and manufacturing transfer. Collaborate with process, device, packaging, reliability, product, and manufacturing teams while using statistical analysis, engineering data, AI-enabled tools, and yield analysis to improve performance, reliability, manufacturability, quality, cost, and schedule.
The summary above was generated by AI
Our vision is to transform how the world uses information to enrich life for all .
Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever.
Department Intro:
The Advanced Packaging Technology Development (APTD) team is developing the packaging and integration technologies that will power future generations of memory products. We bring together engineers, scientists, and innovators who thrive on solving complex technical challenges and turning breakthrough ideas into scalable manufacturing solutions. Working across device engineering, package design, reliability, and manufacturing, we help shape the future of High Bandwidth Memory (HBM) and advanced memory technologies.
Position Overview:
As a Process Integration Engineer, you will play a key role in developing and integrating advanced semiconductor process flows that enable next-generation memory solutions. This position offers the opportunity to lead challenging technical programs, solve complex integration issues, and influence technology decisions from concept through manufacturing transfer. You will work closely with cross-functional teams, use data-driven approaches to guide decisions, and help deliver innovative technologies that balance performance, yield, reliability, manufacturability, and cost.
Responsibilities:
  • Lead process integration projects supporting new technology development programs
  • Partner with process development, device engineering, package design, product engineering, reliability, and manufacturing teams to solve integration challenges
  • Use AI-enabled tools, statistical analysis, and engineering data to accelerate problem solving and decision-making
  • Design, implement, and analyze experiments to improve process performance, yield, variability, and reliability
  • Identify yield limiters and root causes through analysis of metrology, defect, parametric, probe, reliability, and test data
  • Drive corrective actions from root cause identification through implementation and validation
  • Develop and improve integration flows that balance performance, manufacturability, quality, reliability, cost, and schedule requirements
  • Support technology qualification, manufacturing transfer, and development activities across multiple sites

Minimum Qualifications:
  • Bachelor's degree in Electrical Engineering, Chemical Engineering, Materials Science, Physics, Mechanical Engineering, or a related field with 4+ years of semiconductor industry experience; OR Master's degree with 2+ years of semiconductor experience; OR PhD in a related field
  • Experience in process integration, process development, or device development, including experiment design, execution, and analysis
  • Knowledge of semiconductor process integration and memory technologies such as DRAM, NAND, or emerging memory architectures
  • Experience using JMP or similar statistical analysis tools to drive engineering decisions
  • Demonstrated ability to solve complex technical problems using data-driven methods, statistical analysis, DoE, and root-cause investigation

Preferred Qualifications:
  • Experience with advanced packaging technologies such as wafer-level packaging, fan-out packaging, 2.5D/3D integration, TSV, bonding, or chiplet integration
  • Experience supporting technology development, qualification, and transfer into high-volume manufacturing
  • Experience using yield, reliability, electrical, or process data to identify challenges and guide technical decisions
  • Experience developing statistical models, correlation studies, and yield analyses to drive process improvements
  • Experience applying AI or machine learning tools to engineering workflows, analytics, and yield improvement initiatives

As a world leader in the semiconductor industry, Micron is dedicated to your personal wellbeing and professional growth. Micron benefits are designed to help you stay well, provide peace of mind and help you prepare for the future. We offer a choice of medical, dental and vision plans in all locations enabling team members to select the plans that best meet their family healthcare needs and budget. Micron also provides benefit programs that help protect your income if you are unable to work due to illness or injury, and paid family leave. Additionally, Micron benefits include a robust paid time-off program and paid holidays. For additional information regarding the Benefit programs available, please see the Benefits Guide posted on micron.com/careers/benefits .
Micron is proud to be an equal opportunity workplace and is an affirmative action employer. All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, age, national origin, citizenship status, disability, protected veteran status, gender identity or any other factor protected by applicable federal, state, or local laws.
To learn about your right to work click here.
To learn more about Micron, please visit micron.com/careers
For US Sites Only: To request assistance with the application process and/or for reasonable accommodations, please contact Micron's People Organization at [email protected] or 1-800-336-8918 (select option #3)
Micron Prohibits the use of child labor and complies with all applicable laws, rules, regulations, and other international and industry labor standards.
Micron does not charge candidates any recruitment fees or unlawfully collect any other payment from candidates as consideration for their employment with Micron.
AI alert: Candidates are encouraged to use AI tools to enhance their resume and/or application materials. However, all information provided must be accurate and reflect the candidate's true skills and experiences. Misuse of AI to fabricate or misrepresent qualifications will result in immediate disqualification.
Fraud alert: Micron advises job seekers to be cautious of unsolicited job offers and to verify the authenticity of any communication claiming to be from Micron by checking the official Micron careers website in the About Micron Technology, Inc.

Similar Jobs at Micron Technology

One Month Ago
In-Office
Senior level
Senior level
Artificial Intelligence • Hardware • Information Technology • Machine Learning
Develops and integrates semiconductor process flows for advanced memory and packaging technologies, especially wafer-level and reconstructed substrate processing. Leads technical projects, designs experiments, analyzes process and reliability data, resolves integration issues, and collaborates across engineering and manufacturing teams to qualify scalable technologies. Applies data-driven methods and AI tools to improve workflow efficiency, yield, reliability, and technical decision-making.
Top Skills: 2.5D/3D IntegrationAIChiplet IntegrationDesign Of Experiments (Doe)DramFan-Out PackagingHybrid BondingMachine LearningMicrobumpNandSemiconductor Process IntegrationTsvWafer-Level Packaging
One Month Ago
In-Office
Senior level
Senior level
Artificial Intelligence • Hardware • Information Technology • Machine Learning
Develops and integrates advanced semiconductor packaging technologies, including 2.5D/3D stacking, HBM, hybrid bonding, and advanced interconnects. Designs experiments, analyzes yield and defect data, optimizes warpage and process performance, qualifies materials and process flows, and supports technology transfer into manufacturing. Collaborates with design, equipment, reliability, test, and manufacturing teams to deliver production-ready packaging solutions.
Top Skills: 2.5D Packaging3D StackingAdvanced AnalyticsAdvanced InterconnectsCure-Shrinkage ControlsDie StackingHbmHybrid BondingInline MetrologyInterposersMicrobumpsMoldingSemiconductor ManufacturingSpcThermocompression BondingTsvsUnderfillWafer Warpage Modeling
Entry level
Artificial Intelligence • Hardware • Information Technology • Machine Learning
Supports installation, qualification, maintenance, troubleshooting, and optimization of semiconductor manufacturing equipment. The role analyzes equipment failures, improves reliability and uptime, develops preventive maintenance procedures, collaborates with manufacturing and engineering teams, and applies data analytics, automation, and AI-enabled tools to improve manufacturing performance.
Top Skills: 8DAgentic AiData AnalyticsEquipment Monitoring PlatformsFmeaIndustrial Automation SystemsPreventive MaintenancePythonReliability EngineeringRoot Cause AnalysisSemiconductor Manufacturing EquipmentSpc

What you need to know about the Los Angeles Tech Scene

Los Angeles is a global leader in entertainment, so it’s no surprise that many of the biggest players in streaming, digital media and game development call the city home. But the city boasts plenty of non-entertainment innovation as well, with tech companies spanning verticals like AI, fintech, e-commerce and biotech. With major universities like Caltech, UCLA, USC and the nearby UC Irvine, the city has a steady supply of top-flight tech and engineering talent — not counting the graduates flocking to Los Angeles from across the world to enjoy its beaches, culture and year-round temperate climate.

Key Facts About Los Angeles Tech

  • Number of Tech Workers: 375,800; 5.5% of overall workforce (2024 CompTIA survey)
  • Major Tech Employers: Snap, Netflix, SpaceX, Disney, Google
  • Key Industries: Artificial intelligence, adtech, media, software, game development
  • Funding Landscape: $11.6 billion in venture capital funding in 2024 (Pitchbook)
  • Notable Investors: Strong Ventures, Fifth Wall, Upfront Ventures, Mucker Capital, Kittyhawk Ventures
  • Research Centers and Universities: California Institute of Technology, UCLA, University of Southern California, UC Irvine, Pepperdine, California Institute for Immunology and Immunotherapy, Center for Quantum Science and Engineering

Sign up now Access later

Create Free Account

Please log in or sign up to report this job.

Create Free Account