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Nokia

Photonic Integrated Circuit (PIC) Design Engineer

Reposted 13 Days Ago
Be an Early Applicant
Remote or Hybrid
Hiring Remotely in United States
Mid level
Remote or Hybrid
Hiring Remotely in United States
Mid level
Develop next-generation InP Photonic Integrated Circuits for telecom and datacenters. Responsibilities include design, simulation, testing, and fabrication process development.
The summary above was generated by AI

We are developing next-generation coherent telecom and intra-datacenter InP Photonic Integrated Circuits powering optical interconnections.  We need motivated engineers and scientists to spearhead developing new products. 

A range of experience is needed for numerous openings:  Ph.D. in Electrical Engineering, Physics or Solid State Physics, including new graduates through industry veterans will be considered for various roles up to and including leadership. 

NION2026

Responsibilities
  • Key experience should include 1 or more areas 

  •  

    • Design of high-speed Mach-Zehnder Modulator or Electro-Absorption Modulator 

    • Design of high-power or telecom/datacom/datacenter InP lasers (C- or O-band) 

    • Design of photonic integrated circuits, especially including InP materials 

Qualifications
  • Key engineering expertise in several of the following areas required 


  • Design and simulation of photonic devices 

  • Process design/fabrication process development of InP devices or PICs 

  • Photonic device testing of high-speed modulators 

  • RF signal integrity design and simulation 

  • PIC/driver co-design 

  • Extensive photonic device data analysis in manufacturing environment 

  • PIC mask layout design expertise with 10 or more layers 

  • Extensive characterization of semiconductor laser diodes 

 

#OMG

 

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