As a Microelectronics Packaging Design Engineer intern, you'll assist in designing and qualifying microelectronics packages, support product development activities, and participate in failure analysis.
Job Description
Job Description:
Join our team at BAE Systems as a Microelectronics Packaging Design Engineer intern and work on cutting-edge projects that shape the future of aerospace and defense. Our hybrid work format allows for a balance of collaborative in-person and independent remote work.
About Us:
At BAE Systems, we're dedicated to innovating for the future and protecting those who protect us. Our employees work on the world's most advanced electronics, from saving emissions in major cities to powering the Mars Rover. We're a team of bright minds working together to solve the industry's most difficult problems.
Internship Summary:
As a Microelectronics Packaging Design Engineer intern, you'll work closely with experienced engineers to design, develop, and qualify state-of-the-art miniaturized electronic devices. This is an excellent opportunity to apply your knowledge of engineering principles to a dynamic and fast-paced field.
Responsibilities:
Required Education, Experience, & Skills
Preferred Education, Experience, & Skills
Pay Information
Full-Time Salary Range: $53560 - $72306
Please note: This range is based on our market pay structures. However, individual salaries are determined by a variety of factors including, but not limited to: business considerations, local market conditions, and internal equity, as well as candidate qualifications, such as skills, education, and experience.
Temporary employees generally are not eligible for BAE Systems benefits, but can elect to participate in the 401(k) savings plan. Temporary employees working 20+ hours per week are eligible for medical benefits, the employee assistance program, and business travel accident insurance.
About BAE Systems Electronic Systems
BAE Systems, Inc. is the U.S. subsidiary of BAE Systems plc, an international defense, aerospace and security company which delivers a full range of products and services for air, land and naval forces, as well as advanced electronics, security, information technology solutions and customer support services. Improving the future and protecting lives is an ambitious mission, but it's what we do at BAE Systems. Working here means using your passion and ingenuity where it counts - defending national security with breakthrough technology, superior products, and intelligence solutions. As you develop the latest technology and defend national security, you will continually hone your skills on a team-making a big impact on a global scale. At BAE Systems, you'll find a rewarding career that truly makes a difference. Electronic Systems (ES) is the global innovator behind BAE Systems' game-changing defense and commercial electronics. Exploiting every electron, we push the limits of what is possible, giving our customers the edge and our employees opportunities to change the world. Our products and capabilities can be found everywhere - from the depths of the ocean to the far reaches of space. At our core are more than 14,000 highly talented Electronic Systems employees with the brightest minds in the industry, we make an impact - for our customers and the communities we serve.
This position will be posted for at least 5 calendar days. The posting will remain active until the position is filled, or a qualified pool of candidates is identified.
Job Description:
Join our team at BAE Systems as a Microelectronics Packaging Design Engineer intern and work on cutting-edge projects that shape the future of aerospace and defense. Our hybrid work format allows for a balance of collaborative in-person and independent remote work.
About Us:
At BAE Systems, we're dedicated to innovating for the future and protecting those who protect us. Our employees work on the world's most advanced electronics, from saving emissions in major cities to powering the Mars Rover. We're a team of bright minds working together to solve the industry's most difficult problems.
Internship Summary:
As a Microelectronics Packaging Design Engineer intern, you'll work closely with experienced engineers to design, develop, and qualify state-of-the-art miniaturized electronic devices. This is an excellent opportunity to apply your knowledge of engineering principles to a dynamic and fast-paced field.
Responsibilities:
- Assist in the development of microelectronics packaging concepts and technologies
- Participate in product development activities, including packaging design and road mapping efforts
- Contribute to program pursuits and bid estimates
- Support prototype package builds and evaluation efforts
- Assist in the qualification of microelectronics packages
- Participate in failure analysis for microelectronics packages
- Provide support for factory transition of products and manufacturing of microelectronics assemblies
- Currently pursuing a degree in Electrical, Aerospace, Mechanical, or Materials Engineering
- Strong foundation in engineering principles and materials science
- Interest in microelectronics packaging design and development
- Excellent communication and teamwork skills
- Opportunity to work on cutting-edge microelectronics packaging design and development projects
- Collaborative and dynamic work environment
- Professional development and growth opportunities
- Competitive stipend and benefits package
Required Education, Experience, & Skills
- US Person
- All applicants must be able to obtain a DoD Security Clearance at time of application (REQUIRED)
- Currently pursuing a degree in Engineering with focus on Electrical, Aerospace, Mechanical, or Materials Engineering
Preferred Education, Experience, & Skills
- Microelectronics design and manufacturing assemble
- Microelectronics packaging materials and materials properties
- Electronic component reliability testing
- Post wafer fabrication processes
- Failure analysis techniques
- Additive manufacturing
- Wafer fabrication processes
- Advanced thermal packaging design
- RF packaging design
Pay Information
Full-Time Salary Range: $53560 - $72306
Please note: This range is based on our market pay structures. However, individual salaries are determined by a variety of factors including, but not limited to: business considerations, local market conditions, and internal equity, as well as candidate qualifications, such as skills, education, and experience.
Temporary employees generally are not eligible for BAE Systems benefits, but can elect to participate in the 401(k) savings plan. Temporary employees working 20+ hours per week are eligible for medical benefits, the employee assistance program, and business travel accident insurance.
About BAE Systems Electronic Systems
BAE Systems, Inc. is the U.S. subsidiary of BAE Systems plc, an international defense, aerospace and security company which delivers a full range of products and services for air, land and naval forces, as well as advanced electronics, security, information technology solutions and customer support services. Improving the future and protecting lives is an ambitious mission, but it's what we do at BAE Systems. Working here means using your passion and ingenuity where it counts - defending national security with breakthrough technology, superior products, and intelligence solutions. As you develop the latest technology and defend national security, you will continually hone your skills on a team-making a big impact on a global scale. At BAE Systems, you'll find a rewarding career that truly makes a difference. Electronic Systems (ES) is the global innovator behind BAE Systems' game-changing defense and commercial electronics. Exploiting every electron, we push the limits of what is possible, giving our customers the edge and our employees opportunities to change the world. Our products and capabilities can be found everywhere - from the depths of the ocean to the far reaches of space. At our core are more than 14,000 highly talented Electronic Systems employees with the brightest minds in the industry, we make an impact - for our customers and the communities we serve.
This position will be posted for at least 5 calendar days. The posting will remain active until the position is filled, or a qualified pool of candidates is identified.
Top Skills
Additive Manufacturing
Electronic Component Reliability Testing
Engineering Principles
Microelectronics
Rf Packaging Design
Thermal Packaging Design
BAE Systems, Inc. Los Angeles, California, USA Office
5140 W Goldleaf Circle, Los Angeles, CA, United States, 90056-1299
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