Job Family Description
We are seeking a highly motivated and technically skilled engineer to join the team bringing-up and qualifying a new Indium Phosphide (InP) photonics semiconductor fabrication facility. As a Process Development Engineer, you will be a senior individual contributor within Nokia’s Optical Components organization, participating in the development, optimization, and transfer of key process technologies that will enable advanced high-volume manufacturing of InP photonic integrated circuits (PICs).
This role requires technical expertise across semiconductor wafer fabrication methods and related device processing technologies, working closely with fellow engineers and internal stake-holders to enable efficient, high-yield integration of manufacturing processes.
Responsibilities may include:
Process Development & Integration: Developing and optimizing wafer fab process modules (etch, deposition, lithography, metallization, etc.) for InP-based PICs and lasers, ensuring process robustness and repeatability. Developing fabrication process flows based on design requirements, tool capabilities, and manufacturing constraints. Contribute to continuous improvement of tools, methods, and best practices.
Manufacturing Data & Yield Excellence: Analyzing and interpreting data from device and process metrology collected in a manufacturing environment. Applying SPC, process capability analysis (Cp/Cpk), and statistical methods to evaluate and improve process performance.
Technical Leadership:
Collaborating with device design, product engineering, and reliability teams to support technology readiness and product ramp.
Acting as a technical interface with external or remote fabrication facilities and potential equipment vendors, ensuring alignment on process requirements and priorities.
Leading and contributing to FMEA activities, root cause analysis, and corrective actions for yield and reliability issues.
Qualifications- BS/MS or PhD (preferred) in Electrical Engineering, Materials Science, or related field. Minimum of 3 years of experience developing and manufacturing compound semiconductor materials, devices and processes.
- Process design and development for compound semiconductor devices based on III-V materials is highly desirable.
- Metal, semiconductor, and dielectric deposition and etching tools, chemistries, and methods.
- FMEA, SPC, process capability, and metrology.
- Excellent communication and teamwork skills; able to work in a fast-paced startup or ramp-up environment.
About Us
Nokia is a global leader in connectivity for the AI era. With expertise across fixed, mobile and transport networks, powered by the innovation of Nokia Bell Labs, we’re advancing connectivity to secure a brighter world.
Our recruitment process
We act inclusively and respect the uniqueness of people. Our employment decisions are made regardless of race, color, national or ethnic origin, religion, gender, sexual orientation, gender identity or expression, age, marital status, disability, protected veteran status or other characteristics protected by law. We are committed to a culture of inclusion built upon our core value of respect.
If you’re interested in this role but don’t meet every listed requirement, we still encourage you to apply. Unique backgrounds, perspectives, and experiences enrich our teams, and you may be just the right candidate for this or another opportunity.
The length of the recruitment process may vary depending on the specific role's requirements. We strive to ensure a smooth and inclusive experience for all candidates. Discover more about the recruitment process at Nokia.
- Corporate Retirement Savings Plan
- Health and dental benefits
- Short-term disability, and long-term disability
- Life insurance, and AD&D – Company paid 2x base pay
- Optional or Supplemental life and AD&D insurance (Employee/Spouse/Child)
- Paid time off for holidays and Vacation
- Employee Stock Purchase Plan
- Tuition Assistance Plan
- Adoption assistance
- Employee Assistance Program/Work Life Resource Program
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